3D Integration Technologies for Wireless Sensor Systems (e-CUBES)

Technologies For Miniaturized Tire Pressure Monitor System (TPMS)", oral presentation at IMAPS 5th Inter-national Conference and Exhibition on Device packaging,

Fraunhofer IZM developed a pure “via first” 3-D integration process, the so-called ICV-SLID technology based on inter-chip vias (ICV) through the device substrates (through

The main objective was to provide 3D integration technologies which on the one hand increase the performance sufficiently and at the same time allow for cost-efficient fabrication

The two key process technologies required for 3D integration are the fabrication of through silicon/substrate vias (TSVs) and chip-to-wafer or wafer-to-wafer bonding.. The

LowEmission develops new technology solutions and concepts for offshore energy systems and integration with renewable power production technologies.. This will

Figure 3: Hollow vias in a dummy sensor wafer as an alternative solution to Planoptik wafers. The sensor is chip to wafer bonded with Au SBB to a substrate wafer with Daisy chains

Only the first three wafers were etched with satisfactory results (column 12), whereas the rest of the wafers were poorly etched (column 13). A reduced wafer-to-wafer etch rate and

Etch of the cavity housing the inertial sensor (a), Etch of the TSVs (b), oxidation of the wafer (c), fusion bonding of the capping wafer onto the device layer (d) and (e), Vias